New additive Oxylink™ and Grinding & Dispersion equipment to be represented at Chinacoat 2010
06/07/2010 Buhler will be represented at the Chinacoat 2010 in Guangzhou, P. R. China from September 27 - 29, 2010. Buhler business unit Nanotechnology introduces its new functional additive Oxylink™ to the Asian market and the business unit Grinding & Dispersion presents process solutions for manufacturing inks, paints and coatings. Since its inception in 1996, the CHINACOAT (The China Int'l Exhibition for Coatings, Printing Inks and Adhesives) exhibition has been the key event for coatings, printing inks and adhesives suppliers who wish to enter, expand and consolidate their positions in this market. As an annual event, Chinacoat alternates between the cities of Guangzhou and Shanghai. CHINACOAT provides a global platform for exhibitors to meet decision-makers from this industry across the world, from China to Asia Pacific, Europe and Middle East. In terms of size, number of exhibitors and visitors, CHINACOAT is now one of the largest coatings shows in the world today.Asian Rollout of Oxylink™: “The additive for better waterborne coatings”
Buhler dedicates a special booth to present solely its new paint and varnish additive Oxylink™ for waterborne coatings at booth number 10K09/11/1.3. The innovative additive comprises a performance-optimized formulation of nanoparticles in water. Oxylink™ increases the cross-link density of waterborne resin systems which results in an enhanced overall performance including increased MEK rub resistance, blocking and humidity resistance, as well as other resistance properties. In addition, Oxylink™ reduces the time to further processing of the coated substrates. The additive strengthens the film by direct chemical interaction of its tailor-made nanoparticles with the functional groups of the polymeric binder. As Oxylink™ doesn’t change the in-can stability of the formula it is particularly interesting for 1-pack systems.
Oxylink™ was developed by Bühler PARTEC GmbH in Germany. PARTEC is a wholly owned subsidiary of Buhler’s business unit Nanotechnology. It specializes in the processing and refining of nanoparticles (1-100 nm) into ready-to-use performance additives.
Trend setting Buhler solutions in wet grinding and dispersing technology
The Buhler business unit Grinding & Dispersion is bringing the global wet grinding and dispersing technology industry standard to China! Due to the rising requirements regarding grinding efficiency and product properties like particle size, colour strength or gloss the leading manufacturers in the inks, paints and coatings industry are scanning the market for new production solutions. Buhler with its 150 years of experience in the wet grinding and dispersing industry is introducing the latest equipment and production concept in order to increase performance, efficiency and profit.
In addition the business unit Grinding and Dispersion will strengthen its presence in China by opening their RADEC (Research and Development and Education Centre) in Wuxi by September 2010. Buhler will offer their customer the ability to conduct application trials with their product by using the latest grinding technology of Buhler.
Buhler is a global leader in the supply of process engineering solutions, especially production technologies for producing foods and engineering materials. Buhler operates in over 140 countries and has some 7,500 employees worldwide. In fiscal 2009, the Group generated sales (turnover) of CHF 1.7 billion.
For more information, please contact:
Dr. Frank Tabellion, Managing Director
Bühler PARTEC GmbH, Science Park 2, 66123 Saarbrücken, Germany
Phone: +41 681 394 6550, E-mail: frank.tabellion@buhlergroup.com
Mr. Mark Traber, Area Manager China and Asia Pacific
Bühler AG , 9240 Uzwil, Switzerland
Phone: +41 71 955 2362, E-mail: mark.traber@buhlergroup.com
Mr. Zhao Nangang, Business Unit Manager Grinding & Dispersion China
Buhler Beijing Office, Beijing 100020, P.R. China
Phone: +86 010 6588 1707, E-mail: nangang.zhao@buhlergroup.com
Please visit Buhler business unit Nanotechnology at booth number 10K09/11/13 and Grinding & Dispersion at booth 10G41-46.