The Leybold Optics IBT 800 is a highly productive solution for precise flattening and correction of features on wafers using automated handling, batch processing, and a double load lock.
Our ion beam source can be used from feature trimming to bulk removal of materials used in surface acoustic wave (SAW) or bulk acoustic wave (BAW) filters such as the frequency adjustment/surface treatment of piezoelectric materials (e.g. LiNbO3 or LiTaO3), trimming down oxides (e.g. SiO2) for temperature compensation (TC-SAW) or thickness adjustment of nitrides (e.g. Si3N4).
The Leybold Optics IBT 800 smooths silicon wafers for wafer bonding. Insufficient chemical-mechanical polishing (CMP) might lead to surface or thin film deviations which need to be further planarized or trimmed towards a final thickness before wafer-to-wafer bonding can be processed. So the Leybold Optics IBT 800 can address high-level wafer planarization of surfaces and/or adjust the thin film thicknesses, making them ready for bonding.
The IBT 800 uses Bühler's expertise in ion beam figuring and can be equipped with ion sources with an 80 mm RF80 or a 40 mm RF40 capable of a removal rate up to 0.6 or 0.15 mm3/cm, respectively. Can be combined with the ISERM, which is capable of determining an ion beam's etching rate within seconds without breaking vacuum.
When moving workpieces in cassettes on roller conveyers, the IBT 800 is capable of processing batches of multiple wafers, optimising total times and reducing the cost of ownership. Substrate carriers each carrying up to 2x12’’, 3x 8’’, 4x 6’’ or 8x 4’’ wafers are available. Others on request.
This large-volume solution is a clean-room-compatible (ISO5) robot system capable of automatically loading and unloading between substrate carriers and cassettes, reducing operator-wafer interaction.
By integrating OTFP, the layer thickness of dielectric thin films can be determined combining process and metrology in a single system. Semi-transparent layers and semiconductors can be measured with a spectrometer at λ 200-1100nm and a thickness range of 50nm – 50µm.
Two vertical slots with motorized lift for substrate carrier cassettes reduce operation time through parallel machining.
The home of Ion beam figuring and ion beam trimming technologies.
Revolutionizing the RF connectivity industry.
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Ion Beam Trimming Sales Manager
christian.schindler@buhlergroup.com
+49 172 8099 329
Wollkämmereistraße 2
04357
Leipzig
Germany
