Wafer block cutter
Franz Haas AWDM
The Franz Haas AWDM wafer block cutter cuts wafer blocks into smaller wafer fingers.
Key benefits
Efficient cutting
In fully automatic operation, the wafer block cutter performs up to 14 cuts per minute.
Various formats
Change the cutting frames to cut your products into different sizes using wires or blades.
Hygienic production
The stainless steel execution of the wafer block cutter ensures highest hygienic standards. The Franz Haas AWDM is easily accessible to simplify cleaning. Monitor the production process through the polycarbonate cover.
Highlight features
How it works
Bringing wafer blocks into their final form
A rope conveyor feeds the cooled wafer blocks into the cutter. Pushers move them through two cutting frames arranged at a 90° angle. The distances between the cutting wires or blades is variable.
Key topics
Billions of people come into contact with Bühler technologies to cover their basic needs for food and mobility every day. Our motto is creating “innovations for a better world.” Find out more about our key topics.
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Application possibilities
Efficient in every step of production
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Services and training
Our services and training are designed to keep you up to date on products and technologies, giving you the confidence and experience you need.
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Gupfenstrasse 5
Uzwil
9240
Switzerland
